【NEW】 2026/10/5 |
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【EXHIBITION PARTICIPATION INFORMATION】Photonics Innovation 2026 (November 10–12 at Pacifico Yokohama, Exhibition Hall B, Booth B-30).
We will be exhibiting at Photonics Innovation 2026 (held from Tuesday, November 10 to Thursday, November 12, 2026, at Pacifico Yokohama Exhibition Hall B, Booth B-30, in Yokohama, Kanagawa). We will be demonstrating our flagship optical beam measurement systems (NFP and FFP measurement systems) at this event. We will also present a video demonstration of our optical waveguide characterization system, which measures the optical properties of optical waveguides — core technology for CPO devices. Furthermore, We will also present a video demonstration of the integrated optical active module assembly system originally developed by our company.
- 【Exhibition outline】
- Exhibition:Photonics Innovation 2026
- Official Web site (click here for advance visitor registration and other details):Pnotonics Innovation 2026
- Exhibition period:November 10 (Tue) - 12(Thu) 10:00~17:00, 2026.
- Venue:Pacifico Yokohama, Hall-B, Booth No. B-30
- 【Exhibited products】
- NFP measurement system(Demonstration)
System for measurement of emission beam shape and beam width of various optical devices operating in the visible to 1700 nm wavelength range. Utilizing image processing and analysis, it is effective for analyzing the beams of light-emitting elements that exhibit complex emission distribution patterns.
- FFP measurement system(Demonstration)
System for measurement of beam divergence characteristics of various light-emitting devices, ranging from the visible region up to the 1700 nm band. Dedicated FFP measurement optics and image processing method enable real-time analysis of the omnidirectional radiation angle distribution.
- Optical characteristic measuement system for optical waveguide module(video demonstration)
This system measures parameters such as insertion loss, near-field patterns (NFP) at the output facet, far-field patterns (FFP) of the output light, and polarization characteristics of polymer and silicon (Si) optical waveguides—technologies currently attracting significant attention in the field of opto-electronic integration. We will present a video-based product overview and a technical demonstration.
- Integrated optical active module assembly system (EOM assembly system)(video demonstration)
This equipment performs assembly and mounting—specifically high-speed, high-precision alignment and UV bonding—between the optical pins of an optical I/O core chip and an optical fiber array; this core chip is a component of the Embedded Optical Module (EOM), which is anticipated to serve as a next-generation, highly integrated optical transceiver module. We will present a video-based product overview and a technical demonstration.
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【NEW】 2026/4/27 |
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| 2023/7/4 |
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| 2023/6/5 |
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| 2022/6/20 |
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| 2021/11/1 |
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| 2021/7/5 |
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| 2020/12/15 |
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| 2020/11/14 |
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